Glass / Rigid / In-line

In Line describes both a manufacturing methodology as well as a physical substrate movement.  Separate load and unload stations moving product in and out of high vacuum while the process chamber remains under vacuum.  This provides for higher utilization of consumables such as cathodes and thermal evaporation sources as well as reduces shield changes and preventative maintenance. Deposition can either be continuous where the substrate travels past the deposition source or static where the substrate is fixed in front of a deposition source before progressing through the system.

Substrate orientation can be vertical or horizontal with deposition from either above or below the substrate.  Choice of substrate orientation is influenced by deposition method, substrate size, temperature, and throughput requirements.


Chamber arrangement

Configurable, modular platform for either vertical or horizontal systems, consist of Load Locks, Buffer / Heat Chambers, Transfer Chambers and Process Chambers. The number of each chamber type is based on specific coating requirments and line speed.

Process Chambers

Configured typically with Rotatable or Planar cathodes (DC,AC,RF) and plasma pre and post treatments. Single or multiple deposition zones can be configured to create multi-layer coatings by alternating target materials, deposition methodology or vacuum process levels.

Product Lines

Each of the below pre-cut lines are highly configurable based on specific process requirements that balances the cost of capital with production uptime and yield.  Each product and application has unique cost and yield drivers and Mustang works with customers to identify each of these critical factors to ensure the highest level of customer value.

Glossary of Terms

Horizontal systems

Vertical systems


Load lock / Buffer chambers

Transition chambers